Taming Europe’s Semiconductor Landscape

Dataspaces for a Sustainable and Resilient Semiconductor Ecosystem

Image: © Intel Corporation

Building Resilience: Digitalizing Europe’s Semiconductor Value Chain

Our project aims to make the European semiconductor industry sustainable and resilient through comprehensive digitalization and the establishment of traceability. Together with our partners, we are developing new data-driven business models and encouraging innovation along the entire value chain. This will entail

Developing digital twins for the semiconductor industry, which digitally model the supply and value chain and enable sovereign and secure data exchange, including their connectivity to other value partners.

Enabling efficient, sustainable and resilient semiconductor operations through industry-wide digitalization and dataspaces for improved value chain traceability.

Enhancing deep digitalization capabilities among value chain partners, especially small and medium businesses (SMBs).

Developing new data-driven business models and encouraging innovation.

Enabling deep interoperability and AI applications by digitalizing every asset and entity in the semiconductor value chain.

Ensuring the availability of semiconductors to key European technologies and industries.

Horizontal. Vertical. Continuous: Industry-specific implementation clusters

Cluster 1

Resilient value chains for a heterogeneous integration ecosystem

Building competitive and resilient value chains through the comprehensive heterogeneous integration of partners involved in the packaging technology. The semiconductor industry’s complex inbound supply chain comprises 1000 processing steps and crosses over seventy borders.

Cluster 2

Resilient network nodes: digital integration for optimized factory operations

Developing concepts, semantic data models and services for intercompany data exchange in network nodes and the integration of data from and services for factory and supply chain assets in the dataspace.

Cluster 3

Sustainability: environmentally optimized processes

Developing the methodology for storing the life cycle assessment data sets in semantic submodels of the digital twin. Optimizations of the digital twin using machine learning and statistical mathematics.

Project Partners

Intel Deutschland GmbH

Fraunhofer IFF

Fraunhofer EMFT

Fraunhofer IIS

Fraunhofer IWU

Fraunhofer IZM

DAS Environmental Expert GmbH

Elmos Semiconductor SE

Expo21XX GmbH (KIWAI Division)

HTW Dresden

HQ-Dielectrics GmbH

Infineon Technologies AG

Merck Electronics KGaA

OmegaLambdaTec GmbH

OptWare GmbH

Robert Bosch Semiconductor Manufacturing Dresden GmbH

SAP SE

Siemens AG

Systema GmbH

Associated Partners

Athinia Technologies

DHL Customer Solutions & Innovations

DLR e.V.

NetApp Deutschland GmbH

Resonac Holdings K.K.

Roseman Labs

Siemens Digital Logistics

Swissbit Germany AG

Texas Instruments Deutschland GmbH

ZVEI e.V.

News and Project Updates

24. Juni 2024

Research project started: Resilient supply chains for the semiconductor industry

A major research project on the digitalization of supply chains in the semiconductor industry started in May upon the delivery of the letters of funding confirmation. More than twenty partners from the semiconductor industry and its suppliers have teamed up in the Semiconductor-X project under the consortium management of Intel Deutschland and Fraunhofer IFF to make the complex supply chains in this sector more sustainable and more resilient. What is more, new digitalization solutions will enable distributed and sovereign data exchange. The project with a total budget of around €30 million is being funded by the Federal Ministry for Economic Affairs and Climate Action with EU funds (DARP) as part of its Manufacturing-X funding program for the digitalization of industry supply chains.

Read the press release

Semiconductor-X is a Manufacturing-X project focused on the semiconductor industry

Semiconductor-X aims to adapt Gaia-X/Catena-X dataspace architecture to the semiconductor industry and to develop advanced digital twins that digitally model critical planning segments of the semiconductor supply and value chain. The project will also integrate established industry standards into this new dataspace architecture.

Read about Manufacturing-X

Interested? Contact us!

Monika Lischke

Intel Deutschland
Press Department

monika.lischke(at)intel.com

Tobias Kutzler

Fraunhofer IFF
Project Manager | Digital Logistics Infrastructures and Systems Group Manager

tobias.kutzler(at)iff.fraunhofer.de